Lämpöpastat

Lämpöpastat, often translated as thermal paste or thermal compound, are substances used to improve heat transfer between electronic components, most commonly a CPU or GPU, and its corresponding heatsink. Their primary function is to fill microscopic gaps and irregularities on the surfaces of these components. Even surfaces that appear smooth to the naked eye have tiny imperfections. Without thermal paste, these air gaps would act as insulators, hindering the efficient dissipation of heat away from the processor.

Thermal paste is typically a viscous material composed of a base fluid and a filler material. The base fluid is usually silicone-based, but other organic or synthetic fluids can be used. The filler material is crucial for its thermal conductivity and can include metal oxides, ceramic particles, or even diamond dust. The composition of the thermal paste dictates its thermal conductivity, measured in Watts per meter-Kelvin (W/mK). Higher W/mK values indicate better heat transfer capabilities.

The application of thermal paste is a critical step in assembling or upgrading computer hardware. A small, pea-sized amount is usually applied to the center of the CPU's heat spreader. When the heatsink is mounted, the pressure evenly distributes the paste, squeezing out excess and ensuring a thin, uniform layer. Over time, thermal paste can dry out or degrade, leading to reduced thermal performance and potentially higher component temperatures. Therefore, periodic reapplication is recommended for optimal cooling.