Latentwärmespeicher

A latentwärmespeicher is a thermal energy storage system that utilizes the latent heat of phase change materials (PCMs) to store and release thermal energy. Unlike sensible heat storage systems that rely on temperature changes, latent heat storage systems exploit the energy absorbed or released during phase transitions such as melting, freezing, vaporization, or condensation.

The fundamental principle behind latent heat storage involves materials that can change their physical state while maintaining a nearly constant temperature. When heat is applied to a PCM at its melting point, the material absorbs energy to break molecular bonds and transition from solid to liquid phase without significant temperature increase. This stored energy is later released when the material solidifies, making the process highly efficient for thermal energy management.

Common phase change materials include paraffin waxes, salt hydrates, fatty acids, and metallic alloys, each with specific melting points and energy storage capacities. The selection of appropriate PCMs depends on the intended application temperature range, storage density requirements, and thermal cycling stability.

Latent heat storage systems offer several advantages over conventional thermal storage methods. They provide high energy storage density within a narrow temperature range, enable precise temperature control during charging and discharging cycles, and demonstrate relatively low heat losses due to minimal temperature fluctuations.

Applications of latentwärmespeicher technology span across various industries including solar thermal systems, building heating and cooling, industrial process heat management, and electronic device thermal regulation. In solar applications, these systems store excess thermal energy during peak sunlight hours and release it during periods of low solar radiation. Building integration allows for passive thermal regulation, reducing heating and cooling energy demands.

Despite their advantages, latent heat storage systems face challenges including limited thermal conductivity of some PCMs, potential material degradation over extended thermal cycles, and encapsulation requirements to prevent leakage and ensure system longevity. Ongoing research focuses on enhancing thermal performance through composite materials and improved system designs.