HPALprosessointi
HPALprosessointi, or High-Pressure Air Leakage (HPAL) processing, is a method used to remove contaminants from surfaces, particularly in the context of electronics manufacturing. The process involves the use of high-pressure air to dislodge and remove particles, such as dust, debris, and residues, from surfaces. This technique is commonly employed in the cleaning of printed circuit boards (PCBs), semiconductor wafers, and other sensitive electronic components.
The HPAL process typically operates at pressures ranging from 5 to 15 bar (72.5 to 217.5 psi).
One of the key advantages of HPAL processing is its ability to clean delicate and complex surfaces
However, the effectiveness of HPAL processing can be influenced by several factors, including the type and
In summary, HPAL processing is a versatile and effective method for cleaning surfaces in electronics manufacturing.