Copperplated

Copperplated refers to a surface that has been coated with a thin layer of copper. The copper layer is applied by electroplating or electroless plating to improve conductivity, solderability, wear resistance, and appearance. On nonconductive substrates, a conductive seed layer and adhesion promotion are required.

Electroplating uses a copper sulfate-based solution and electrical current to deposit copper on a conductive substrate. Electroless copper plating deposits copper chemically without external current, often followed by post-deposition treatment. Typical thicknesses for copperplating range from a few hundred nanometers for decorative finishes to several tens of micrometers for electrical and structural uses. In electronics, copper plating is used to form conductive traces and pads on printed circuit boards and connectors.

Copper plating improves electrical conductivity, heat transfer, solderability, and corrosion resistance in appropriate environments. It also provides a uniform, bright surface suitable for subsequent finishing, such as tin, nickel, or gold plating.

Applications include electronics manufacturing (PCB traces and through-holes), connectors and contact surfaces, decorative hardware, and protective finishes on various metal parts. Historically, copper plating has been used in coinage and jewelry, and it remains common as a base layer for other metallizations.

Limitations and considerations: adhesion depends on substrate preparation and bath chemistry; copper can tarnish and form patina; diffusion and stress can affect adhesion and durability at thickness extremes. Plating baths involve hazardous chemicals and require proper waste treatment and safety controls.