3Dintegroitumisessa
3Dintegroitumisessa refers to the integration of electronic, photonic, or biosensing components into three‑dimensional geometric structures. This approach extends beyond traditional planar layout by stacking functional layers and routing signals through vertical interconnects such as through‑silicon vias (TSVs) or micro‑bump arrays. The primary goal of 3D integration is to increase component density, improve performance through shorter inter‑die distances, and reduce power consumption by lowering the overall signal path length.
Historically, 3D integration emerged in the 1990s with the advent of advanced packaging technologies. Early implementations
Applications are broad. In high‑end mobile processors, 3D NAND flash and compute‑on‑die architectures combine memory and
Key challenges involve thermal management, as stacked layers can trap heat, and yield risk, since defects in