rpesi
RPESI, or the Rapid Plasma Etching System, is a specialized tool used in the semiconductor industry for the precise removal of materials from a substrate. It operates on the principle of plasma etching, where a gas is ionized to create a plasma, which then reacts with the material on the substrate to remove it. RPESI systems are designed to handle a wide range of materials, including silicon, silicon dioxide, and various metals, and are capable of achieving high aspect ratios and fine feature sizes.
The RPESI process typically involves several steps. First, the substrate is placed in the system, and a
RPESI systems are widely used in the fabrication of semiconductor devices, as they allow for the creation