fotorõhkeid

Fotorõhkeid, also known as photoresist or resist, is a light-sensitive material used in photolithography to form a patterned coating. It is a key component in processes that create micro- or nanostructures on a substrate, most commonly in the semiconductor industry for manufacturing integrated circuits.

There are two main types of fotorõhkeid: positive and negative. With a positive fotorõhkeid, the areas exposed to light become soluble in a developer solution and are removed. The unexposed areas remain on the substrate. Conversely, with a negative fotorõhkeid, the exposed areas polymerize or cross-link, becoming insoluble in the developer. The unexposed areas are then removed, leaving the exposed pattern behind.

The process typically involves coating a substrate with fotorõhkeid, exposing it to patterned light through a mask, developing it to remove either the exposed or unexposed regions, and then using the remaining fotorõhkeid as a protective layer during subsequent etching or deposition steps. After these processes, the fotorõhkeid is stripped away. The sensitivity and resolution of fotorõhkeid are critical factors determining the minimum feature size that can be fabricated. Advances in fotorõhkeid technology have been crucial for the continuous miniaturization and increased performance of electronic devices.