Wärmeleitkörpern

Wärmeleitkörpern, also known as heat sinks, are passive heat exchangers that cool electronic or mechanical devices by dissipating heat into the surrounding medium. The primary purpose of a heat sink is to increase the surface area available for heat transfer. This is typically achieved through the use of fins, pins, or other extended surfaces. The material of the heat sink is crucial, with common choices being aluminum alloys and copper due to their high thermal conductivity. Aluminum is often preferred for its lower cost and weight, while copper offers superior heat dissipation but is more expensive and heavier.

The effectiveness of a heat sink depends on several factors, including its material properties, design (shape and size of fins), contact surface area with the heat-generating component, and the thermal properties of the surrounding environment. Air is the most common medium for heat dissipation, but liquid cooling systems also utilize heat sinks. To ensure efficient thermal transfer from the heat source to the heat sink, a thermal interface material (TIM), such as thermal paste or a thermal pad, is typically applied between the component and the heat sink. This material fills microscopic air gaps, which are poor conductors of heat, thereby improving the overall thermal contact. Heat sinks are essential components in a wide range of applications, from personal computers and power supplies to industrial machinery and high-power electronics, preventing overheating and ensuring reliable operation.