Vapordeposited

Vapordeposited, or vapor-deposited, refers to materials formed by depositing material from a vapor phase onto a substrate to create a thin film or coating. The process uses gaseous or vapor-phase chemistry conducted under vacuum or controlled atmospheric conditions. The resulting films typically exhibit high density, good adhesion, and precise thickness control.

The major families are physical vapor deposition (PVD) and chemical vapor deposition (CVD). In PVD, material is physically transferred from a source by evaporation, sputtering, or other means, and condenses on the substrate. It yields dense films with good hardness and adhesion, often at relatively moderate temperatures. In CVD, volatile precursors react at the substrate surface to form a solid deposit, enabling conformal coatings on complex geometries and a wide range of materials.

Variants and related techniques include atomic layer deposition (ALD), a precise subset of CVD that deposits films one atomic layer at a time, and pulsed laser deposition, metal-organic chemical vapor deposition, and sputter deposition. Common deposited materials include nitrides, oxides, carbides, and metals such as TiN, Al2O3, Si3N4, diamond-like carbon, and copper.

Applications encompass semiconductor devices, optics, protective and hard coatings for cutting tools, wear and corrosion resistance, and coatings for MEMS and solar cells. The choice between deposition methods depends on required conformality, film density, temperature tolerance, and substrate compatibility. Challenges include process complexity, equipment cost, precursor handling, and environmental considerations.