Puolijohdesäilykkeet

Puolijohdesäilykkeet, often translated as semiconductor preservatives or semiconductor encapsulants, are materials used to protect semiconductor devices from environmental degradation and mechanical damage. These materials are crucial for the long-term reliability and performance of electronic components. They typically form a protective casing or coating around the delicate semiconductor die, which is the core functional part of the device.

The primary function of puolijohdesäilykkeet is to act as a barrier against moisture, dust, chemicals, and other contaminants that can interfere with the electrical properties of the semiconductor or cause corrosion. They also provide mechanical support, preventing the semiconductor from cracking or breaking due to stress or impact during manufacturing, handling, or operation. Additionally, some encapsulants are designed to dissipate heat generated by the semiconductor, thus preventing overheating and ensuring stable operation.

Common materials used for puolijohdesäilykkeet include various polymers such as epoxies, silicones, and polyurethanes. The choice of material depends on the specific application requirements, including temperature resistance, electrical insulation properties, adhesion, and cost. For instance, epoxy molding compounds are widely used for their excellent mechanical strength and protection against moisture. Silicone encapsulants offer good flexibility and thermal stability, making them suitable for applications where thermal cycling is a concern. The encapsulation process itself is a critical step in semiconductor manufacturing, ensuring that the devices can function reliably in diverse and often harsh environments.