Postwafer

Postwafer is a term used in the semiconductor industry to describe the stage of manufacturing after the wafer has been processed into individual chips, but before the final packaging and testing. This intermediate phase is crucial for ensuring the quality and functionality of the integrated circuits.

During the postwafer stage, several key processes take place. First, the wafer undergoes dicing, where a diamond saw or laser cuts the wafer into individual rectangular or square units, known as die. Each die contains a complete integrated circuit. Following dicing, the die are inspected for defects, such as cracks, chips, or incomplete connections. This inspection is often automated using optical and electrical testing methods.

Once the die are deemed acceptable, they are mounted onto lead frames or substrates. This process, called die attach, involves securing the die using an adhesive or solder. After die attach, wire bonding is performed. Thin wires, typically made of gold or copper, are used to connect the electrical pads on the die to the leads of the package. Finally, the die and its connections are encapsulated in a protective material, such as plastic or ceramic, to shield them from environmental damage and mechanical stress. This encapsulation marks the completion of the postwafer process, leading into the final stages of packaging and testing.