Polyimidfilm

Polyimidfilm, also known as polyimide film, is a class of thin, heat‑resistant polymer film derived from polyimide resins. It combines high thermal stability, excellent dielectric properties, and good mechanical integrity over a wide temperature range, making it suitable for electrical insulation and flexible substrates in electronics and aerospace.

Production typically involves forming a polyamic acid precursor by condensation of a dianhydride and a diamine, casting or extruding to form a film, and then converting the polyamic acid to polyimide by imidization (thermal or chemical). Common commercial formulations include films based on pyromellitic dianhydride with 4,4'-oxydianiline, as used in Kapton, as well as other family brands such as Upilex.

Key properties include high glass transition temperatures and thermal stability, outstanding dielectric strength, low creep, and good chemical resistance. Polyimide films show excellent dimensional stability, low water absorption, and tolerance to repeated temperature cycling and vacuum conditions. Mechanical properties depend on thickness and formulation, but films generally maintain flexibility and stiffness across a wide temperature range.

Applications span insulation and substrates for flexible printed circuits, cables and wires, spacecraft and aviation components, and various electronic devices that require reliable performance at elevated temperatures. Kapton and Upilex are among the best known commercial polyimide film brands, reflecting the material’s prominence in high‑reliability electronics and extreme‑environment applications.

Health, safety and environmental notes: polyimide films are stable but can release toxic gases when burned, and recycling options are limited in many regions. They are typically processed with specialized high‑temperature equipment and handled with standard industrial precautions for polymers and solvents used in film production.