Physicalvapor

Physicalvapor is a term occasionally used in materials science to denote the gaseous phase of a material that is generated by physical, rather than chemical, means. Vapors produced by physical processes such as evaporation, sputtering, or laser ablation may be described as physicalvapor. The term is not widely standardized and is often used informally to refer to the vapor phase in physical vapor deposition contexts.

In practice, physicalvapor is produced under vacuum or low-pressure conditions to minimize gas-phase reactions. The vapor's composition is typically close to the source material, though it can differ due to selective evaporation, fragmentation, or re-evaporation of constituents. Species range from atoms and molecules to small clusters, with energy distributions governed by the generation method and chamber conditions.

Physicalvapor plays a central role in physical vapor deposition techniques such as evaporation, sputtering, and pulsed laser deposition. These methods enable the fabrication of thin films and coatings with controlled thickness, microstructure, and, in some cases, stoichiometry. Applications include optical coatings, semiconductor devices, protective layers, and surface-engineering coatings used in automotive, aerospace, and industrial settings.

Compared with chemical vapor deposition, which relies on gas-phase chemical reactions to form the film, physical vapor deposition emphasizes the transport of material through the vapor phase without chemical transformation. The distinction helps practitioners optimize deposition kinetics, purity, and film properties, though in practice some processes blur the line between physical and chemical pathways.