MikroBump

MikroBump is a term used in semiconductor manufacturing to describe a very small, localized defect in the surface of a semiconductor wafer. These defects are typically microscopic in size, often measured in micrometers or even nanometers. They can manifest as raised areas or small protrusions on the wafer surface.

The presence of MikroBumps can be problematic for several reasons. During the fabrication process, subsequent layers of material are deposited onto the wafer. A MikroBump can interfere with the uniformity of these depositions, leading to variations in film thickness or electrical properties. This can ultimately affect the performance and reliability of the integrated circuits (ICs) manufactured on the wafer.

Several factors can contribute to the formation of MikroBumps. These can include contamination particles introduced during manufacturing steps, imperfections in the photolithography process, or issues with etching or deposition techniques. Controlling the cleanroom environment and optimizing process parameters are crucial for minimizing their occurrence.

Detecting MikroBumps is typically done using advanced inspection equipment, such as optical microscopes or scanning electron microscopes (SEMs). Various automated optical inspection (AOI) systems are employed to scan wafers for such defects. Once detected, their impact on device yield is assessed, and process adjustments are made to prevent their recurrence. The ability to identify and control MikroBumps is a critical aspect of ensuring high-quality semiconductor production.