Mems

MEMS stands for microelectromechanical systems, integrating mechanical elements, sensors, actuators, and electronics on a common silicon substrate. Devices range from micrometers to a few millimeters, enabling miniature systems with moving parts and integrated circuits. They combine microfabrication processes used in semiconductor manufacturing with mechanical components.

Manufacturing uses micromachining techniques such as bulk micromachining, surface micromachining, and wafer bonding. Standard lithography and deposition steps create movable structures like cantilevers, gears, membranes, and comb drives. Devices may be packaged on-chip or in topologies that protect delicate parts while maintaining access to signals. Integration with CMOS allows signal processing close to the sensor.

Common MEMS components include inertial sensors (accelerometers, gyroscopes), pressure and flow sensors, microfluidic components, and micro-actuators (electrostatic, piezoelectric, or thermal). The term also covers microphones, RF MEMS switches, and optical MEMS such as micro-mirrors. Reliability and packaging are key concerns due to mechanical wear and environmental exposure.

Applications span automotive safety systems, consumer electronics (mobile devices, wearables), medical devices and diagnostics, industrial automation, aerospace, and communications.

Advantages include small size, low power, batch manufacturability, and potential cost reductions at high volumes. Challenges include packaging, long-term reliability, environmental susceptibility, and the complexity of integrating mechanical and electronic subsystems. Research continues in heterogeneous integration, new materials, and NEMS to extend functionality and reduce power and footprint.