Kytkentäliima
Kytkentäliima, also known as conductive glue or electrically conductive adhesive, is a type of adhesive that contains conductive filler materials, such as silver, carbon, or nickel particles, suspended in a polymer resin. When the adhesive cures, these conductive particles form a continuous network, allowing for electrical current to flow through the bonded material.
This unique property makes kytkentäliima suitable for a variety of electronic applications where soldering might be
The conductivity of kytkentäliima can vary significantly depending on the type and amount of conductive filler