Kytkentäliima

Kytkentäliima, also known as conductive glue or electrically conductive adhesive, is a type of adhesive that contains conductive filler materials, such as silver, carbon, or nickel particles, suspended in a polymer resin. When the adhesive cures, these conductive particles form a continuous network, allowing for electrical current to flow through the bonded material.

This unique property makes kytkentäliima suitable for a variety of electronic applications where soldering might be impractical or undesirable. It is often used in situations requiring low-temperature curing, flexible connections, or for bonding dissimilar materials that cannot withstand the heat of soldering. Common uses include repairing printed circuit boards, attaching surface-mount components, creating conductive pathways in flexible electronics, and in applications within the automotive and aerospace industries.

The conductivity of kytkentäliima can vary significantly depending on the type and amount of conductive filler used, as well as the formulation of the polymer resin. While generally not as conductive as solid metal conductors like solder or copper, it offers sufficient conductivity for many low-power electronic applications. The application process typically involves mixing two components (resin and hardener) before applying the mixture to the surfaces to be joined. Curing can occur at room temperature or may be accelerated with heat. Safety precautions, such as good ventilation and the use of gloves, are recommended during handling due to the presence of various chemicals.