K56Flex

K56Flex is a modular, ultra‑thin flexible printed circuit board (FPC) family designed for use in compact electronic devices such as wearable sensors, medical implants, and foldable displays. Developed by FlexiTech Industries in 2019, the K56 series emphasizes high bend radius performance, low insertion loss, and compatibility with standard surface‑mount technology. The “K56” designation references the board’s nominal thickness of 56 µm, while “Flex” denotes its capability to sustain repeated flexing cycles without degradation of electrical continuity.

The construction of K56Flex boards combines a copper foil layer of 12 µm with a polyimide substrate that offers a dielectric constant of 3.2, enabling high‑density routing of up to 30 µm line/space configurations. The product line includes variants with single‑sided, double‑sided, and multilayer constructions, as well as options for solder mask, gold plating, and embedded passive components. According to manufacturer data, K56Flex can endure over 10 000 flex cycles at a radius of 1 mm, meeting standards set by IPC‑2223 for flexible circuitry.

Since its introduction, K56Flex has been adopted in a range of applications, including smart textiles, implantable cardiac monitors, and roll‑able display prototypes. Industry analysts note that the series' balance of mechanical resilience and electrical performance positions it competitively against rival offerings from larger PCB manufacturers. Ongoing development focuses on reducing material costs and expanding thermal resistance to support emerging high‑power flexible electronics.