Jootematerjal

Jootematerjal, often referred to as solder, is a fusible metal alloy used in soldering, which is a process of joining metal workpieces when they are melted. The key characteristic of jootematerjal is its lower melting point than the metals being joined. This allows the solder to melt and flow between the surfaces of the workpieces, creating a strong electrical and mechanical bond once it solidifies.

Historically, jootematerjal was primarily composed of tin and lead. However, due to environmental and health concerns associated with lead, lead-free solders have become increasingly prevalent, especially in the electronics industry. These lead-free alloys typically use combinations of tin with other metals such as silver, copper, bismuth, or antimony. The specific composition of the jootematerjal determines its melting point, strength, and other properties.

The application of jootematerjal involves heating the workpieces and the solder to the solder's melting point. A flux is often applied to the surfaces to be joined before soldering. Flux is a chemical cleaning agent that removes oxides and other contaminants, preventing them from interfering with the solder flow and the formation of a good joint. Once melted, the jootematerjal flows into the gap between the parts and solidifies upon cooling, creating a conductive and durable connection. Jootematerjal is essential in electronics manufacturing, plumbing, and various metal fabrication processes.