Ioncutting

Ioncutting is a subtractive manufacturing process that utilizes a focused beam of ions to erode material from a workpiece. Similar in principle to sandblasting, ioncutting employs a stream of charged particles, typically noble gas ions like argon or xenon, accelerated to high energies. These ions are directed at the surface of the material, and upon impact, they transfer kinetic energy, causing atoms to be dislodged from the surface. This process of sputtering or ablation removes material layer by layer.

The focused ion beam (FIB) system is the core component of ioncutting. It comprises an ion source, an acceleration column, and a focusing lens system. By precisely controlling the ion beam's intensity, energy, and dwell time, intricate patterns and features can be precisely machined. This allows for sub-micron resolution in material removal, making it suitable for applications requiring extreme precision.

Ioncutting finds applications in various fields, including microelectronics for circuit repair and modification, failure analysis for cross-sectioning and imaging of microscopic structures, and nanotechnology for fabricating nanoscale devices. Its ability to perform precise material removal without generating significant heat or mechanical stress makes it advantageous for delicate materials and complex geometries. However, the process can be relatively slow compared to other subtractive methods and is typically used for small-scale or high-value applications due to equipment costs.