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Reflow soldering is a process in electronics manufacturing where solder paste is applied to printed circuit boards (PCBs) and components are placed onto the paste. The assembly is then heated in a reflow oven, causing the solder to melt and form a permanent electrical connection between the component and the PCB. This method is widely used for surface-mount technology (SMT) components.
The reflow process typically involves several stages. First, a solder paste, a mixture of solder powder and
The temperature profile is critical for successful reflow soldering. It must be high enough to melt the