metallipinnoitusmenetelmä

Metallipinnoitusmenetelmä, commonly known as metal plating, is a surface finishing process where a thin layer of metal is deposited onto another material, typically a metal or plastic, through electrochemical means. This process is widely used to enhance the properties of the substrate, such as its appearance, corrosion resistance, wear resistance, electrical conductivity, or solderability. The most common method is electroplating, which involves immersing the object to be plated (the cathode) and a piece of the plating metal (the anode) in an electrolytic solution. When an electric current is passed through the solution, metal ions from the anode or the solution are attracted to the cathode and deposit as a solid layer.

Other methods of metal plating include electroless plating, which uses a chemical reaction rather than an electric current to deposit the metal. This method is useful for plating irregularly shaped objects or non-conductive materials. Physical vapor deposition (PVD) and chemical vapor deposition (CVD) are also techniques used for metal deposition, often for specialized applications requiring very thin or specific types of coatings. The choice of plating metal and method depends on the desired outcome and the substrate material. Common plating metals include chromium, nickel, copper, zinc, gold, and silver. The thickness and uniformity of the plating layer are critical factors controlled by parameters such as current density, plating time, and electrolyte composition.