lämpölevyihin

Lämpölevyihin, known in English as heat plates or thermal pads, are a type of material used to facilitate heat transfer between two surfaces. They are typically made from a soft, compressible material that can conform to uneven surfaces, ensuring good contact and efficient heat dissipation. The primary function of a lämpölevy is to fill microscopic air gaps between components that would otherwise act as insulators, hindering the flow of heat. This is crucial in many electronic devices where heat generated by components like CPUs, GPUs, or power modules needs to be effectively removed to prevent overheating and ensure optimal performance and longevity.

The composition of lämpölevyihin varies, but common materials include silicone, graphite, and various polymers. These materials are often infused with thermally conductive fillers such as ceramic particles, metal oxides, or carbon-based materials to enhance their heat transfer capabilities. The thermal conductivity of a lämpölevy is a key specification, measured in watts per meter-kelvin (W/mK), indicating how well it conducts heat. Higher values generally mean better performance.

Lämpölevyihin are widely used in computers, gaming consoles, automotive electronics, power supplies, and LED lighting. They are an alternative to thermal paste in some applications, particularly where a more robust or easily handled solution is desired. Their ability to conform to surfaces makes them ideal for larger or irregularly shaped components where achieving uniform pressure with thermal paste might be difficult.