lämpökuplatekniikkaa
Lämpökuplatekniikka, known in English as thermosonic bonding or heat-pulse bonding, is a soldering technique used in electronics manufacturing. It is a method for attaching components to printed circuit boards or other substrates by applying localized heat and pressure. The process relies on the rapid heating and cooling of a small area to create a solder joint.
In practice, a bonding tool, often a heated tip or probe, is brought into contact with the
This technique is particularly advantageous for delicate components or when minimizing heat exposure to the surrounding