lämpösiirtopainatuslevyt

lämpösiirtopasta, often referred to as thermal paste or thermal compound, is a substance used to improve heat transfer between a heat-generating component, such as a CPU or GPU, and a heat sink. Its primary function is to fill microscopic air gaps between the two surfaces, which would otherwise act as insulators and hinder efficient cooling. Air has poor thermal conductivity, and the tiny imperfections on the surfaces of components and heat sinks create these insulating air pockets.

Thermal paste is typically a viscous material, often a paste or grease, that is applied in a thin layer. It is formulated with materials that have high thermal conductivity, such as metallic oxides, ceramics, or even metallic particles, suspended in a base substance like silicone oil. When pressure is applied, the paste spreads out, displacing the air and creating a more continuous thermal path. This allows heat to flow more effectively from the component to the heat sink, which then dissipates it into the surrounding environment, often with the aid of a fan.

Proper application of thermal paste is crucial for optimal cooling performance. Too little paste may not adequately fill the gaps, while too much can create an insulating layer itself and potentially spread to other components. The consistency and composition of thermal paste can vary, influencing its thermal conductivity, viscosity, and longevity. Different types of thermal paste are available, catering to various applications and performance needs.