jäähdytyslevyyn

Jäähdytyslevy, or heatsink in English, is a passive heat exchanger that cools a device by dissipating heat into the surrounding medium. Typically, the medium is air, but sometimes it can be liquid. Heatsinks are used to lower the temperature of components that generate a significant amount of heat, such as CPUs, GPUs, and power transistors, preventing them from overheating and malfunctioning.

The effectiveness of a heatsink depends on several factors, including its material, surface area, and the thermal conductivity of the material. Common materials for heatsinks are aluminum alloys and copper due to their excellent thermal conductivity and relatively low cost. The design of a heatsink often involves fins or pins, which significantly increase the surface area exposed to the cooling medium, thereby enhancing heat transfer. The larger the surface area, the more efficiently heat can be dissipated.

Installation of a heatsink usually involves direct contact with the heat-generating component. To ensure efficient thermal transfer, a thermal interface material (TIM), such as thermal paste or a thermal pad, is often applied between the component and the heatsink. This material fills microscopic air gaps, which are poor conductors of heat, creating a more continuous thermal path. In some applications, a fan is attached to the heatsink to actively force air over the fins, increasing the rate of convective heat transfer and further improving cooling performance. This combination of a heatsink and a fan is known as an active heatsink.