Waferthin
Waferthin is a category of ultra-thin, wafer-sized substrates used in electronics, optics, and sensing. Characterized by their extreme thinness and planar geometry, waferthin materials are typically thinner than 200 micrometers, with common thicknesses around 50 to 150 micrometers and standard diameters ranging from small chips to several hundred millimeters.
Common materials include silicon, glasses, ceramics such as alumina, and polymer-based laminates. Hybrid structures may combine
Manufacturing usually involves thinning an existing substrate to the target thickness, using grinding and chemical mechanical
Properties and advantages include light weight, high surface-area-to-volume ratio, and potential flexibility. Limitations often include brittleness
Applications span flexible electronics, MEMS substrates, imaging sensors, photonics, and energy storage components. Waferthin formats are
Origin and usage are primarily in research and specialized manufacturing contexts; the term has not achieved