Szilíciumlemezek

Szilíciumlemezek, often referred to as silicon wafers, are thin discs made from highly purified silicon. They serve as the foundational substrate for the fabrication of most semiconductor devices, including integrated circuits (microchips). The production of these wafers is a complex and demanding process that begins with the growth of large, single-crystal silicon ingots, typically using the Czochralski method. These ingots are then sliced into thin wafers, which are subsequently ground, lapped, and polished to achieve an extremely flat and smooth surface, essential for the delicate microfabrication processes that follow.

The purity of the silicon is paramount, with semiconductor-grade silicon often exceeding 99.9999% purity. This high purity minimizes defects that could otherwise disrupt the electrical properties of the fabricated devices. Szilíciumlemezek are manufactured in standardized diameters, with common sizes ranging from 100 mm (4 inches) to 300 mm (12 inches), and research is ongoing for even larger wafers. The surface of the wafer is treated to remove any surface contamination and is then ready for photolithography, etching, deposition, and diffusion processes that create the intricate patterns of transistors and other components that make up an electronic circuit. After the devices are fabricated, the wafer is diced into individual chips, which are then packaged.