Syrakopparplätering

Syrakopparplätering, often referred to as acid copper plating, is an electroplating process used to deposit a layer of copper onto a substrate from an acidic electrolyte solution. This technique is widely employed in various industries due to its ability to produce a smooth, bright, and highly conductive copper deposit. The electrolyte typically consists of copper sulfate and sulfuric acid, along with additives that control the properties of the plated layer, such as brightness, leveling, and ductility.

The process involves immersing the object to be plated, acting as the cathode, and a copper anode into the acidic copper bath. When an electric current is applied, copper ions from the electrolyte are reduced and deposited onto the cathode. The sulfuric acid provides conductivity and helps to dissolve copper from the anode, replenishing the copper ions in the solution.

Syrakopparplätering is particularly useful as an underlayer in multi-metal plating sequences, such as in the electronics industry for printed circuit boards (PCBs). It provides excellent solderability and conductivity, and its smooth surface allows for subsequent plating of other metals like nickel and gold with improved adhesion and uniformity. It is also used for decorative purposes, offering a bright, lustrous copper finish that can be left as is or further plated. The control over deposition thickness and uniformity makes it a versatile and cost-effective method for achieving specific surface properties.