ReflowLötverfahren
ReflowLötverfahren, also known as reflow soldering, is a soldering process used in the electronics industry to create a permanent electrical connection between electronic components and a printed circuit board (PCB). It is a widely adopted technique, especially for surface-mount technology (SMT) components.
The process begins with the application of solder paste, a mixture of solder powder and flux, to
In the reflow zone, the solder paste melts, forming a molten solder joint that wets the component