Ni3Sn

Ni3Sn is an intermetallic compound formed between nickel (Ni) and tin (Sn). It has a cubic crystal structure with the space group Pm-3m. This compound is often found in solder joints and electronic components where nickel and tin come into contact. The formation of Ni3Sn is a crucial factor in the reliability and performance of these applications. It exhibits relatively high hardness and a melting point of approximately 970 degrees Celsius. The stoichiometry of Ni3Sn indicates a ratio of three nickel atoms to one tin atom. This phase is one of several intermetallic compounds that can form in the Ni-Sn binary system, with others including Ni-Sn, NiSn, and Ni3Sn2. The presence and growth rate of Ni3Sn layers are influenced by factors such as temperature, time, and the specific processing conditions. Understanding the formation and properties of Ni3Sn is important for materials science and engineering, particularly in the fields of microelectronics and metallurgy.