Kemikaalipinnoitus

Kemikaalipinnoitus, also known as electroless plating, is an autocatalytic chemical process used to deposit a metal coating onto a substrate. Unlike electroplating, it does not require an external electrical current. Instead, the reaction is driven by a chemical reducing agent present in the plating bath. The process involves immersing the substrate in an aqueous solution containing metal ions, a reducing agent, and other additives like complexing agents and stabilizers.

The reducing agent chemically reduces the metal ions in the solution, causing them to deposit as a solid metal layer onto the surface of the substrate. This deposition occurs uniformly over the entire surface, including complex shapes and internal cavities, making it ideal for applications where uniform coating thickness is crucial. Common metals deposited via electroless plating include nickel, copper, and gold.

Electroless nickel plating is particularly widespread due to its excellent corrosion resistance, hardness, and wear resistance. It is often used in the electronics, aerospace, and automotive industries for components like printed circuit boards, connectors, and engine parts. Electroless copper plating is widely used in the fabrication of printed circuit boards for creating conductive pathways. Electroless gold plating is employed for its conductivity and corrosion resistance in electronics and jewelry. The specific properties of the deposited coating can be controlled by adjusting the bath composition and operating parameters.