Kemikaalipinnoitus
Kemikaalipinnoitus, also known as electroless plating, is an autocatalytic chemical process used to deposit a metal coating onto a substrate. Unlike electroplating, it does not require an external electrical current. Instead, the reaction is driven by a chemical reducing agent present in the plating bath. The process involves immersing the substrate in an aqueous solution containing metal ions, a reducing agent, and other additives like complexing agents and stabilizers.
The reducing agent chemically reduces the metal ions in the solution, causing them to deposit as a
Electroless nickel plating is particularly widespread due to its excellent corrosion resistance, hardness, and wear resistance.