Jäähdytyslohkon

Jäähdytyslohko, often referred to as a heatsink in English, is a passive heat exchanger device that cools a component by dissipating heat into the surrounding medium, usually air. It is typically made of thermally conductive materials such as aluminum or copper. The fundamental principle behind a heatsink's operation is to increase the surface area from which heat can be transferred to the environment, thereby lowering the operating temperature of the component it is attached to.

Heatsinks are commonly used in electronic devices where components generate significant amounts of heat, such as CPUs, GPUs, power transistors, and LEDs. Without adequate cooling, these components can overheat, leading to reduced performance, instability, or permanent damage. The design of a heatsink often involves fins or pins that extend from a base, significantly increasing the total surface area available for heat dissipation. The effectiveness of a heatsink depends on factors like the material's thermal conductivity, the size and shape of the fins, and the airflow around the heatsink.

The attachment of a heatsink to the heat-generating component is crucial for efficient heat transfer. Thermal paste or thermal pads are often used between the component and the heatsink's base to fill any microscopic air gaps, ensuring good thermal contact. In some applications, active cooling methods like fans are used in conjunction with heatsinks to force airflow over the fins, further enhancing heat dissipation. This combination is known as an active heatsink. In simpler applications, the natural convection of air is sufficient.