Juotteet
Juotteet are the joints formed when electronic components are attached to printed circuit boards or wires using solder. In Finnish usage, juote refers to the interface created by melting filler metal to bond metallic surfaces. The most common solder alloys are tin–lead (historically) and lead‑free tin‑silver‑copper (SAC) formulations used today. Flux, often rosin-based, cleans surfaces and promotes wetting to ensure a reliable electrical and mechanical connection. Juotteet can be produced by reflow soldering for surface‑mount devices or by wave soldering for through‑hole components.
Joint geometry and quality describe a juote. Ideal joints have good fillets, complete wetting, and the absence
Quality control encompasses visual inspection, automated optical inspection (AOI), and, for complex packages, X-ray analysis. Standards