Galvanointimenetelmät

Galvanointimenetelmät refer to electrochemical processes used to deposit a thin layer of metal onto a conductive surface. This process, also known as electroplating, utilizes an electrolytic cell consisting of an anode, a cathode, and an electrolyte solution containing ions of the metal to be deposited. When an electric current is passed through the electrolyte, metal ions from the anode or the electrolyte migrate to the cathode (the object to be plated) and are reduced, forming a solid metal coating.

There are several types of galvanointimenetelmät, each suited for specific applications. Hot-dip galvanizing involves immersing the metal object in molten zinc, forming a protective coating through a metallurgical reaction. Electrogalvanizing, on the other hand, uses an electrolytic process to deposit zinc. Other common galvanointimenetelmät include plating with nickel, chromium, copper, and precious metals like gold and silver.

The primary purpose of galvanointi is to enhance the properties of the base material. This often involves improving corrosion resistance, as many plating metals, such as zinc and cadmium, act as sacrificial anodes, corroding preferentially to protect the underlying metal. Additionally, galvanointi can improve wear resistance, hardness, conductivity, and provide decorative finishes. The thickness and uniformity of the deposited layer are critical factors controlled by parameters such as current density, plating time, electrolyte composition, and temperature. Proper surface preparation of the substrate is essential for good adhesion of the plated layer.