Elektroniklödnin

Elektroniklödnin is the process of attaching electronic components to a printed circuit board by melting solder so that it adheres to metal leads and pads. The aim is to create electrically conductive and mechanically stable joints with proper electrical contact.

Common methods include hand soldering with a soldering iron, reflow soldering for surface-m mount components, and wave soldering for through-hole assemblies. Hand soldering is typical in prototyping and repair, while reflow and wave methods are used in mass production to achieve consistent joints.

Solders and fluxes are key materials. Historically, tin–lead solders were common, but many regions now prefer lead‑free alloys such as SAC305 due to environmental regulations. Flux helps remove oxides and improves wetting; rosin-based fluxes are traditional, while water‑soluble fluxes are easier to clean. Flux residues may be cleaned or left if the product tolerates small amounts of residue.

Joint quality depends on temperature control, cleanliness, and technique. Excessive heat can damage components or boards; insufficient heat results in cold joints or poor wetting. A good joint forms a smooth fillet around the lead and pad without solder bridges between adjacent joints. Common defects include cold joints, solder bridges, tombstoning of small components, and voids in solder.

Safety and standards are important. Adequate ventilation is required to manage fumes, and electrostatic discharge precautions are used when handling boards. Standards such as IPC‑A‑610 and J‑STD‑001 provide criteria for acceptable solder joints and assembly quality.

Environmental and regulatory considerations favor lead‑free solders and proper disposal of solder waste.