CuCuAbstände

CuCuAbstände refers to the distances between copper atoms in copper-containing materials. In crystallography, the term describes the interatomic spacings between copper atoms, typically the nearest-neighbor distance in the crystal lattice. Copper crystallizes in a face-centered cubic (fcc) structure. At room temperature, the lattice parameter a is about 3.615 ångströms. The distance between nearest copper atoms is d_nn = a/√2 ≈ 2.556 ångströms. Distances to further neighbors include d_next ≈ a ≈ 3.615 ångströms.

Temperature and pressure influence CuCuAbstände. The lattice expands with increasing temperature, with copper’s linear thermal expansion coefficient around 16.5 × 10^-6 per kelvin near room temperature, causing larger CuCu distances at higher temperatures. Applied pressure tends to reduce these distances.

Alloying and defects also modify CuCuAbstände. In copper alloys, such as Cu-Ni systems, the lattice parameter changes with composition roughly according to Vegard’s law. Defects, vacancies, and dislocations create local variations in interatomic spacings, especially at surfaces or in nanostructures.

Measurement and relevance. Lattice spacings are commonly determined by X-ray diffraction or electron diffraction techniques. Local distances in nanostructures, surfaces, or amorphous copper-containing materials can be probed with high-resolution transmission electron microscopy (TEM), scanning tunneling microscopy (STM), or extended X-ray absorption fine structure (EXAFS). Understanding CuCuAbstände is important for diffusion processes, mechanical properties, and the performance of copper in interconnects and alloys, as well as for modeling lattice strain in thin films and heterostructures.