Backsidetekniikalla
Backsidetekniikalla, literally translated from Finnish as “backside technique,” refers to a set of processes employed in manufacturing and material processing that target the rear surface of a substrate or component. The method is most widespread in semiconductor fabrication, micro‑electronics, and advanced metalwork, where treatments such as thinning, doping, or deposition are applied from the backside after front‑side patterning has been completed.
The origins of backsidetekniikalla lie in the microelectronics boom of the 1970s, when the need to reduce
Typical steps of the technique include mechanical thinning or lapping of the substrate, implantation of dopants
Benefits of backsidetekniikalla include reduced package height, lower thermal resistance, and the ability to create electrodes
In addition to electronics, variations of the backside technique are employed in precision optical polishing, where