upotusjuottaminen
Upotusjuottaminen, also known as dip soldering, is a soldering process where a component or a substrate is submerged into a bath of molten solder. This technique is commonly used for soldering through-hole components onto printed circuit boards (PCBs) or for soldering wires and other metallic parts. The molten solder bath provides a consistent and efficient way to create electrical and mechanical connections.
The process typically involves preparing the surfaces to be soldered, often by cleaning and applying flux to
Upotusjuottaminen can be performed manually or automated. Manual dip soldering involves dipping individual components into a