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Reflow soldering is a process in electronics manufacturing where solder paste is applied to printed circuit boards, components are placed onto the paste, and then the assembly is heated in an oven to melt the solder and create permanent electrical connections. This method is widely used for surface-mount technology (SMT) components. The process typically involves several stages: applying solder paste, placing components, and reflow soldering itself, followed by inspection.

The solder paste is a suspension of fine solder particles in a flux vehicle. It is usually applied through a stencil or screen, creating precise patterns on the board where components will be mounted. Once the components are placed onto the solder paste, the entire assembly is moved into a reflow oven. The oven has different temperature zones, gradually increasing the temperature to preheat the board and components, then to the peak reflow temperature where the solder melts, and finally to a cooling zone to solidify the solder joint.

The flux within the solder paste plays a crucial role. It cleans the surfaces of the components and the copper pads on the PCB, removing oxides and preventing further oxidation during the heating process. This ensures good solder wetting and the formation of strong, reliable joints. The reflow process allows for the simultaneous soldering of many components, making it highly efficient for mass production. Precise control over the temperature profile is essential to avoid issues like solder bridging, tombstoning, or component damage. After reflow, the boards undergo inspection, often using automated optical inspection (AOI) or X-ray inspection, to verify the quality of the solder joints.