pooljuhtketta

Pooljuhtketta, often referred to as a semiconductor wafer, is a thin slice of semiconductor material, typically silicon, that serves as the base substrate for manufacturing integrated circuits, commonly known as microchips. These wafers are meticulously manufactured to be extremely pure and crystalline, as any imperfections can drastically affect the performance of the electronic components built upon them.

The process of creating integrated circuits on a pooljuhtketta involves a series of complex steps. Photolithography is used to transfer intricate circuit patterns onto the wafer's surface. This is followed by various etching, deposition, and doping processes that selectively alter the semiconductor material to create transistors, resistors, and other electronic components. Each wafer can hold hundreds or even thousands of individual chips.

Once the fabrication process is complete, the wafer is tested for defects. The individual chips are then cut from the wafer using a diamond saw or laser, a process called dicing. Each diced chip is then packaged into the familiar black casing with metallic pins that allow it to be connected to a circuit board. The size of pooljuhtkettas can vary, with common diameters being 200mm and 300mm, influencing the number of chips that can be produced in a single batch. The continuous advancement in pooljuhtketta technology is fundamental to the miniaturization and increasing power of electronic devices.