nanoplaten

Nanoplaten is a nanoscale plating platform designed to deposit conductive or barrier layers on nanoscale features. The term denotes a small, patterned deposition interface that enables localized electrochemical growth at dimensions well below a micrometer.

The nanoplaten typically consists of a substrate carrying an array of micro- or nanoelectrodes or a patterned conductive film. By applying spatially controlled electrical bias, masking, or microfluidic delivery of electrolyte, ions are directed to predefined sites, allowing selective plating and filling of high aspect ratio structures.

Fabrication involves standard nanofabrication steps: lithographic patterning of electrodes, deposition of conductive films, and the use of insulating layers to confine deposition. Auxiliary techniques such as nanoimprint, electron-beam lithography, or focused ion beam patterning may be employed to define the plating regions.

Materials deposited via nanoplaten include metals such as copper, nickel, gold, or silver, as well as conductive polymers or ceramic-like films. The choice of electrolyte, additives, and temperature controls deposition quality, uniformity, and grain structure at the nanoscale.

Applications span nanowire and nanopore fabrication, seed layers for further growth, plasmonic nanostructure formation, and microelectromechanical systems components. The technology aims to improve material efficiency, precision, and integration with other top-down and bottom-up nanofabrication methods.

Current status remains primarily in research and development, with demonstrations focusing on patterned deposition at sub-100-nm scales and integration with lithographic workflows. Challenges include achieving uniform coverage across complex geometries, managing defects, and scaling to high-throughput production.