Waferskivor

Waferskivor, or wafer discs, are thin circular substrates used primarily in the semiconductor industry. They provide the foundation for fabricating integrated circuits and other microdevices. The term is Swedish and is used to describe silicon wafers, though the concept is standard worldwide.

Most waferskivor are made from high-purity silicon. They are produced by crystallizing silicon using methods such as the Czochralski process or the float-zone technique to form a single crystal ingot. The ingot is sliced into thin discs, then ground, lapped, and polished to achieve a smooth, mirror-like surface. Surfaces are cleaned to remove contaminants before device processing. While silicon is the most common material, waferskivor can also be made from gallium arsenide, silicon carbide, or quartz for specialized applications.

Standard wafer diameters vary by production line, from small 25 mm wafers to the large 300 mm disks used in modern fabs. Common thicknesses are under 1 millimeter. Wafers are specified by crystallographic orientation, resistivity, and dopant type, which influence device fabrication.

Applications include substrates for integrated circuits, power devices, microelectromechanical systems (MEMS), photonics, and solar cells. After fabrication, wafers may be tested, diced, and packaged into final components.

Quality control is strict, with measurements of surface roughness, thinning, bow, warp, and contamination. Wafers are processed in cleanroom environments and handled with tooling designed to prevent damage or contamination.