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SiOC2H54

SiOC2H54 is not a widely recognized chemical entry in major databases, and the exact meaning of this designation is unclear. In many contexts, the term may be a proprietary label or a misnotation related to silicon oxycarbide–type materials. The broader family typically denoted as SiOC refers to silicon oxycarbides, which are amorphous ceramics or polymer-derived ceramics containing silicon, oxygen, carbon, and sometimes hydrogen.

Composition and structure

SiOC-like materials are characterized by a network that includes Si–O–C linkages with varying carbon content. Hydrogen

Synthesis

Common preparation routes involve pre-ceramic polymers, such as polycarbosilanes or silicon-containing resins, that contain carbon-rich moieties.

Properties

SiOC materials typically exhibit high thermal stability, good mechanical strength for ceramics, and adjustable density and

Applications

Potential uses include protective coatings, refractory matrix materials in composites, diffusion barriers, and dielectric components in

Safety

Handling follows standard practices for inorganic ceramics and organosilicon polymers. Dust and pyrolysis byproducts may pose

See also

Silicon oxycarbide; Pre-ceramic polymers; Organosilicon compounds.

may
be
present
as
terminal
substituents
or
as
part
of
organic
groups
attached
to
silicon
or
carbon.
Depending
on
processing
and
precursors,
the
material
can
range
from
predominantly
inorganic
to
highly
interconnected
carbon-containing
networks,
influencing
properties
such
as
density,
toughness,
and
dielectric
behavior.
These
polymers
are
shaped
or
coated
and
then
pyrolyzed
at
high
temperatures
under
inert
or
reducing
atmospheres
to
yield
silicon
oxycarbide
ceramics.
Adjusting
the
carbon
content,
atmosphere,
and
thermal
profile
allows
tuning
of
microstructure
and
properties.
If
hydrogen-containing
groups
are
retained,
characteristic
C–H
features
may
persist
in
the
material.
dielectric
properties.
The
presence
of
carbon
can
enhance
fracture
toughness
and
influence
electrical
characteristics,
while
the
oxide–carbon
network
governs
thermal
and
chemical
resistance.
electronics
where
a
balance
of
thermal
stability
and
controlled
conductivity
is
desired.
inhalation
or
irritation
hazards;
appropriate
ventilation
and
personal
protective
equipment
are
advised.