RFsputterointi
RF sputterointi, or radio frequency sputtering, is a physical vapor deposition (PVD) technique used to deposit thin films onto a substrate. It is a variant of magnetron sputtering that utilizes radio frequency (RF) power instead of direct current (DC) power to generate and sustain the plasma. This difference in power source allows RF sputtering to be effective for depositing insulating materials, which are typically difficult or impossible to sputter using DC methods.
The process begins by creating a plasma in a low-pressure inert gas environment, usually argon. An RF
The key advantage of RF sputtering is its ability to sputter both conductive and insulating materials. In