Plazmakeevitus

Plazmakeevitus, a term derived from Finnish, refers to the process of plasma etching. Plasma etching is a fundamental technique used in microfabrication, particularly in the semiconductor industry, to remove material from a substrate. It utilizes a plasma, an ionized gas, to chemically or physically alter the surface of the material. This process is crucial for creating intricate patterns on semiconductor wafers, such as transistors and integrated circuits.

The plasma is typically generated by exposing a gas, such as a mixture of fluorine or chlorine-containing compounds, to an electric field. This electric field energizes the gas molecules, causing them to break down into ions, electrons, and neutral radicals. These reactive species then interact with the substrate surface. In physical etching, energetic ions bombard the surface, dislodging atoms. In chemical etching, neutral radicals react with the surface material to form volatile byproducts, which are then pumped away.

Plazmakeevitus offers advantages such as high anisotropy, meaning it can etch vertically with minimal undercutting, which is essential for creating fine features. It also allows for precise control over the etching depth and rate. The specific gases and plasma conditions can be tailored to etch different materials, including silicon, silicon dioxide, and various metals, with high selectivity. This makes it a versatile and indispensable tool in modern manufacturing processes.