NiederdruckCVD
NiederdruckCVD, also known in English as low‑pressure chemical vapor deposition, is a thin‑film deposition technique in
The process begins by introducing precursor gases into a vacuum chamber equipped with a heated stage. The
Industrially, NiederdruckCVD is widely used for deposition of silicon dioxide, silicon nitride, aluminum oxide, and various
Key equipment includes a load‑lock chamber, mass‑flow controllers for precise gas mixing, a heating system that
Advantages of NiederdruckCVD are the high uniformity, reduced contamination from background gases, and the ability to