Magnetronipuhallus

Magnetronipuhallus, often translated as magnetron sputtering, is a physical vapor deposition technique used to apply thin films onto surfaces. It involves creating a plasma in a vacuum chamber and using magnetic fields to confine and intensify the plasma. This intensified plasma then bombards a target material, causing atoms to be ejected from the target. These ejected atoms travel through the vacuum and deposit onto the substrate, forming a thin film.

The process begins by evacuating a chamber to a high vacuum. A small amount of inert gas, typically argon, is introduced. A high voltage is then applied between the target material (cathode) and the chamber walls (anode). This voltage ionizes the gas, creating a plasma. Powerful magnets are positioned behind the target, creating a magnetic field that traps electrons near the target surface. This confinement increases the electron density and ionizes more gas atoms, making the plasma more efficient at sputtering the target material. The accelerated ions from the plasma strike the target, dislodging atoms or molecules. These sputtered particles then deposit onto the substrate, which is usually placed opposite the target.

Magnetron sputtering is a versatile technique used in various applications, including the production of optical coatings, semiconductor devices, decorative coatings, and protective layers on tools. It allows for precise control over film thickness and composition, and can deposit a wide range of materials, including metals, alloys, ceramics, and composites. The magnetic field's influence allows for higher deposition rates and lower operating pressures compared to simple diode sputtering.