Lämpötahna

Lämpötahna, often referred to as thermal paste or thermal compound, is a substance used to facilitate heat transfer between a heat-generating component and a heat-dissipating component. In electronics, this typically involves the interface between a CPU or GPU and its heatsink. The primary purpose of thermal paste is to fill in the microscopic imperfections and air gaps that exist on the surfaces of these components. Air is a poor conductor of heat, and without thermal paste, these air gaps would significantly impede the efficiency of heat dissipation.

When a heat-generating component like a CPU is placed in contact with a heatsink, the surfaces, even when appearing smooth, have microscopic irregularities. These irregularities create air pockets that act as insulators. Thermal paste, being a viscous material with high thermal conductivity, displaces the air and fills these gaps, creating a much more efficient thermal bridge. This improved contact ensures that heat generated by the component can be effectively transferred to the heatsink, which then dissipates it into the surrounding environment, often with the aid of a fan.

The effectiveness of thermal paste is measured by its thermal conductivity, typically expressed in watts per meter-Kelvin (W/mK). Higher values indicate better heat transfer capabilities. There are various types of thermal paste available, differing in their composition, such as silicone-based, ceramic-based, metal-based, and carbon-based compounds. The choice of thermal paste can impact the operating temperatures of electronic components, potentially influencing their performance and longevity. Proper application is crucial, as too little paste may not adequately fill the gaps, while too much can sometimes lead to reduced effectiveness or even short-circuiting in extreme cases.