Lämpökuplatekniikan

Lämpökuplatekniikka, known in English as thermosonic bonding or thermocompression bonding, is a joining process used in electronics manufacturing. It relies on the application of heat and pressure to create a bond between two conductive materials, typically a wire and a pad. The process involves placing a wire, often made of gold or aluminum, onto a metal pad on a semiconductor chip or a substrate. Simultaneously, a heated capillary tool is brought down to press the wire against the pad.

The heat softens the materials, and the pressure deforms them, allowing for interdiffusion and the formation of a metallurgical bond. This process is often performed in a controlled atmosphere to prevent oxidation. The temperature and pressure levels are carefully managed to ensure a strong and reliable connection without damaging the delicate electronic components. Lämpökuplatekniikka is widely used for wire bonding in integrated circuits, semiconductor packaging, and other microelectronic applications where precise and reliable interconnections are crucial. Its advantages include its ability to create strong bonds and its suitability for a variety of materials. However, it requires precise control of process parameters.