Lämpöputkitekniikka

Lämpöputkitekniikka, known in English as heat pipe technology, refers to a passive heat transfer device that leverages the phase change of a working fluid to transfer heat efficiently. A heat pipe typically consists of a sealed tube, a wick structure lining the inner surface, and a working fluid. The working fluid is chosen based on the operating temperature range.

The operation of a heat pipe involves several steps. At the evaporator section, heat is absorbed from the heat source, causing the working fluid to vaporize. This vapor then travels through the hollow interior of the pipe to the condenser section, where it is cooled by a heat sink and condenses back into a liquid. The liquid then returns to the evaporator section via capillary action through the wick structure, completing the cycle. This continuous loop allows for very high effective thermal conductivity, often exceeding that of solid metals.

Heat pipes are widely used in applications requiring efficient heat dissipation or transfer. Common uses include cooling electronic components such as CPUs in computers, thermal management in satellites and spacecraft, and in various industrial heating and cooling systems. Their advantages include high thermal conductivity, reliability, no moving parts, and the ability to operate in various orientations. The design and choice of working fluid are critical for optimizing performance in specific temperature ranges and heat flux conditions.